Semiconductors & Electronics

Production of the micro-electronic elements must retain features of large production scale, small physical dimension and small performance variance, since the purity and uniformity of the sputtering targets material are all required for producing the thin film of the final product. In addition, precision ingredient combinations also significantly affect the thin film electronic properties of these products. Based on this concern, apart from developing high purity target,

alloy-sputtering-targets

DXAM also aims at the additive arrangement of the alloy element as well as the uniformity of content texture that explores many know-how technologies to support sputtering targets employed in micro-electronics DXAM possesses the capacity for developing and manufacturing target made by dual alloy and many other ternary alloys and even higher, and hot rolling process are precisely controlled to guarantee uniform microstructure.

DXAM is a professional manufacturing factory for superior metal and metal alloy sputtering targets as well as evaporation materials, we are focus on providing the most suitable and high quality thin film materials for our customers. Our regular products applied in semiconductor & electronics are in below form, if you have special request, please contact our sales engineer for more information.

Semiconductors Sputtering Targets:

Application Field Materials Manufacturing Method Purpose of Use 
Electrode materialsW (5N)Powder sinteringGate area
W (6N, 7N)CVDGate etc.
Co(5N)Melting methodGate area
Ni(5N)Melting methodGate area
Ti(5N)Melting methodLynear, Barrier etc.
Various silicide(4N up)Powder sintering
Wiring MaterialsAl(5N, 5N5) & Al alloy such as AlCu(5N, 5N5)Vacuum melting methodInter conect
Cu(6N)Melting methodInter conect
Compound semiconductor materialsAu, Au alloy(4N)Melting methodWiring
WSi(5N)Powder sinteringElectrode
SiO2(4N,6N)Artificial/ natural quartzInsulating material
Mounting & wiringAl(5N, 5N5)& Al alloy(5N, 5N5)Vacuum melting methodWiring
Cu(4N)Melting methodWiring
Cr(3N)Powder sinteringBarriers
Precious metal materialsMelting methodWiring
TiW(4N up)Powder sinteringBarriers
Ni(4N)Melting methodBarriers
Capacitor materialsBSTPowder sinteringDRAM/thin film capacitors
PZTPowder sinteringFeRAM
Barrier materialsTi(4N5)Melting method
TiW(4N up)Powder sintering

semiconductor coatings

Semiconductors & Micro-Electronics Sputtering Targets:

Product NameElement Symbolpurityshape
Materials List Applied To Semiconductors & Micro-Electronics
Gold Sputtering TargetAu0.9999Round sputtering target, rectangle sputtering target, evaporation pellets
Cobalt Sputtering TargetCo3N5Planar target, Rotary target
Aluminum Sputtering TargetAl3N5, 4N, 4N6, 5N, 6NPlanar target, Rotary target
Nickel Chromium Sputtering TargetNi + Cr3N, 3N6, 4NPlanar target, Rotary target
Copper Sputtering TargetCu4N, 5N, 6NPlanar target, Rotary target
Nickel Sputtering TargetNi3N, 3N6, 4N, 4N5, 5NPlanar target, Rotary target
Nickel Iron Sputtering TargetNi + Fe3N5, 4NPlanar target
Nickel Vanadium Sputtering TargetNi + V3N, 3N6, 4NPlanar target, Rotary target
Iron Sputtering TargetFe3N, 3N5, 4NPlanar target, Rotary target
Titanium Sputtering TargetTi3N, 4N, 4N5, 5NPlanar target, Rotary target
Vanadium Sputtering TargetV2N5, 3NPlanar target, Rotary target
Tungsten Sputtering TargetW3N5Planar target, Rotary target
Tantalum Sputtering TargetTa3N5, 4NPlanar target, Rotary target
Niobium Sputtering TargetNb3N, 3N5, 4NPlanar target, Rotary target

Electronics sputtering targets