Bismuth (Bi) Sputtering Target

High purity Bi sputtering Target Manufacturer | Bismuth Sputtering Target Supplier in China-DXAM

DXAM is a top sputtering Target Manufacturer specializing in Bismuth Sputtering Target|Bi Targets with high quality and low price according to requested shapes,size,purity and drawing.


The leading sputtering targets manufacturer specializing in high purity Bismuth Sputtering Target/Bi sputtering target for shape,size,purity and drawing,etc.

Material TypeBismuth
Atomic Weight208.9804
Atomic Number83
Color/AppearanceLustrous Reddish White, Metallic
Thermal Conductivity8 W/m.K
Melting Point (°C)271
Coefficient of Thermal Expansion13.4 x 10-6/K
Theoretical Density (g/cc)9.8
Z Ratio0.79
Max Power Density*
(Watts/Square Inch)
Type of BondIndium, Elastomer
Export Control (ECCN)1C229
CommentsResistivity high. Low Melting Point materials not ideal for sputtering.


Bismuth is a chemical element with the symbol Bi and atomic number 83. Bismuth, a prevalent post-transition metal and one of the photogenic, chemically resembles its lighter homologs arsenic and antimony. Elemental bismuth may occur naturally, although its sulfide and oxide form important commercial ores. The free element is 86% as dense as lead. It is a brittle metal with a silvery white color when freshly produced, but surface oxidation can give it a pink tinge. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals.

Material Notes

Bismuth Sputtering Targets, Purity is 99.9-99.999%;
Circular: Diameter <= 14inch, Thickness >= 1mm;
Block: Length <= 32inch, Width <= 12inch, Thickness >= 1mm.

Other Information of Bismuth Sputtering Targets

• Electronics
• Semiconductor
• Flat panel displays
• Competitive pricing
• High purity
• Grain refined, engineered microstructure
• Semiconductor grade
Manufacturing Process
• Refining
Three-layer electrolytic process
• Melting and casting
Electrical resistance furnace – Semi-continuous casting
• Grain refinement
Thermomechanical treatment
• Cleaning and final packaging – Cleaned for use in vacuum
Protection from environmental contaminants
Protection during shipment
• 99.9% minimum purity
• Planar circular targets up to 14” (355.6mm) diameter
• Planar tiles up to 32” (812.8mm) X 12” (304.8mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service