Aluminum Copper alloy sputtering target AlCu

High purity Aluminum Copper Alloy Sputtering Targets|AlCu Sputtering Targets Manufacturer


DXAM can customize Aluminum Copper Alloy Sputtering Targets | AlCu Sputter Targets with high quality and low price according to requested shapes,size,purity and drawing,etc.Cd Targets are used in the manufacturing of  Semiconductor,Chemical vapor deposition (CVD),Physical vapor deposition (PVD) display,etc.


Description

High Quality Aluminum Copper alloy sputtering target manufacturer,High Purity AlCu sputter targets supplier in China.

Aluminum Copper (AlCu) Alloy Sputtering Targets 
Purity— 99.9%,99.95%,99.99%, or International standards type
Component—Custom-Made Shape— Discs, Plate, Step,Taper (Dia ≤300mm,,  Thickness ≥1mm)
Rectangle, Sheet,  Step (Length ≤500mm, Width ≤300mm, Thickness ≥1mm)
Tube( Diameter< 300mm,  Thickness >2mm, rotary target)
Application — Conductor contacts in microcircuits.

Aluminum Copper (AlCu) Alloy 
Component— AlCu 70/30, AlCu 67/33, AlCu 65/35, AlCu 50/50, AlCu70/30, Custom-Made
Shape— Ingots, Irregular pieces, Custom-Made

Aluminum Copper Phosphorus  (AlCuP) Alloy 
Component— AlCuP 77/20/3
Shape— Ingots, Irregular pieces, Custom-Made

General

DXAM specializes in producing high purity Aluminum Copper (Al/Cu) Sputtering Targets with the highest possible density. High Purity (99.9%) Aluminum Copper Sputtering Targets with smallest possible average grain sizes can be used for semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications.

Other Information of Copper Aluminum Sputtering Targets/CuAl

Applications
• Semiconductor
• Chemical vapor deposition (CVD)
• Physical vapor deposition (PVD) display
Features
• Competitive pricing
• High purity
• Grain refined, engineered micro structure
• Semiconductor grade

 

Manufacturing Process
• Refining
Three-layer electrolytic process
• Melting and casting
Electrical resistance furnace – Semi-continuous casting
• Grain refinement
Thermostatically treatment
• Cleaning and final packaging – Cleaned for use in vacuum
Protection from environmental contaminants
Protection during shipment
Options
• 99.9% minimum purity
• Planar circular targets up to 18” (457mm) diameter
• Planar tiles up to 48” (1200mm) X 15.75” (400mm) for larger target configurations
• Smaller sizes also available for R&D applications
• Sputtering target bonding service